Qualcomm CVEs & Vulnerabilities
64 CVEs affecting Qualcomm products, tracked from the National Vulnerability Database, with CVSS/EPSS scores and exploitation status.
Most Affected Products
Memory Corruption when accessing freed memory due to concurrent fence deregistration and signal handling.
Memory corruption while using alignments for memory allocation.
Memory Corruption when processing invalid user address with nonstandard buffer address.
Memory Corruption when adding user-supplied data without checking available buffer space.
Memory Corruption while invoking IOCTL calls when concurrent access to shared buffer occurs.
Memory Corruption when accessing trusted execution environment without proper privilege check.
Transient DOS when MAC configures config id greater than supported maximum value.
Weak configuration may lead to cryptographic issue when a VoWiFi call is triggered from UE.
Memory Corruption while processing IOCTL calls when concurrent access to shared buffer occurs.
Memory Corruption when concurrent access to shared buffer occurs due to improper synchronization between assignment and deallocation of buffer resources.
Cryptographic Issue when a shared VM reference allows HLOS to boot loader and access cert chain.
Memory Corruption when accessing a buffer after it has been freed while processing IOCTL calls.
Memory Corruption when concurrent access to shared buffer occurs during IOCTL calls.
Memory corruption while handling different IOCTL calls from the user-space simultaneously.
Memory Corruption when accessing buffers with invalid length during TA invocation.
Transient DOS when an LTE RLC packet with invalid TB is received by UE.